WehavealargeamountofSamsung,Murata,TDK,andKEMETinstock.Thespecificinformationofsomerecentlyshippedmodelsisasfollows:PartNumber:CL31B225KCHSNNEManufacturer:SamsungElectro-MechanicsCapacitance:2.2µ

WehavealargeamountofSamsung,Murata,TDK,andKEMETinstock.Thespecificinformationofsomerecentlyshippedmodelsisasfollows:PartNumber:CL31B225KCHSNNEManufacturer:SamsungElectro-MechanicsCapacitance:2.2µ

Anoperationalamplifierisacircuitunitwithaveryhighamplificationfactor.Intheactualcircuit,itisusuallycombinedwiththefeedbacknetworktoformacertainfunctionalmodule.Itisanamplifierwithspecialcouplingcircui

MCUisanintelligentsemiconductorIC.CPU,SRAM,Flash,counterandotherdigitalandanalogmodulesareintegratedintoonechiptoformasmallandcompletemicrocomputersystem,whichcanbecontrolledindifferentcombinationsfor

ULN2803ADWR is 50V Bipolar (BJT) Transistor Array from Texas Instruments.

With the development of the industry and technology, many different types of integrated circuit packaging have appeared. The following is an introduction to some common integrated circuit packaging types:

Pls check our hot offer from Texas Instruments and Toshiba.They have more competitive prices than other platforms, the delivery time is only 2-3 business days, and have a one-year guarantee

MLCC is the abbreviation of multi layer ceramic capacitors, which is a chip multilayer ceramic capacitor. The ceramic dielectric membrane with printed electrode (inner electrode) is superposed in a staggered way, and ceramic electronic components are formed by one-time high-temperature sintering, and then metal layers (outer electrode) are sealed at both ends of the electronic components, so as to form a structure similar to monolith.