Thanks to the Dutch customers for their new orders, they purchased diodes, FPGA chips and other products:
Part Number：MM5Z3V0T1G
Manufacturer：onsemi
Description ：Zener Diode 3 V 500 mW ±6.7% Surface Mount SOD-523
Category：Discrete Semiconductor Products - Single Zener Diodes
Voltage - Zener (Nom) (Vz)：3 V
Tolerance：±6.7%
Power - Max：500 mW
Impedance (Max) (Zzt)：100 Ohms
Current - Reverse Leakage @ Vr：10 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If：900 mV @ 10 mA
Operating Temperature：-65°C ~ 150°C
This series of Zener diodes is packaged in a SOD-523 surfacemount package. They are designed to provide voltage regulationprotection and are especially attractive in situations where space is at apremium. They are well suited for applications such as cellularphones, hand held portables, and high density PC boards
Part Number：TLP118(TPL,E
Manufacturer：Toshiba Semiconductor and Storage
Description ：Logic Output Optoisolator 20Mbps Open Collector 3750Vrms 1 Channel 15kV/µs CMTI 6-SO, 5 Lead
Category：Isolators - Logic Output Optoisolators
The Toshiba TLP118 consists of an infrared emitting diodes and integrated high-gain, high-speed photodetectors.
The TLP118 is housed in the SO6 package. The output stage is an open collector type.
The photodetector has an internal Faraday shield that provides a guaranteed common-mode transient immunity of ±15 kV/μs.
Part Number：TLP290(GB-TP,SE
Manufacturer：Toshiba Semiconductor and Storage
Description ：Optoisolator Transistor Output 3750Vrms 1 Channel 4-SO
Category：Isolators - Transistor, Photovoltaic Output Optoisolators
TLP290(SE consist of photo transistor, optically coupled to two infrared emitting diode connected inverse parallel, and can operate directly by AC input current.
The TLP290(SE is housed in the very small and thin SO4 package.
Since TLP290(SE are guaranteed wide operating temperature (Ta=-55 to 110˚C) and high isolation voltage (3750Vrms), it’s suitable for high-density surface mounting applications such as programmable controllers and hybrid ICs.
Part Number：MURD620CTT4G
Manufacturer：onsemi
Description ：Diode Array 1 Pair Common Cathode 200 V 3A Surface Mount TO-252-3, DPak (2 Leads + Tab), SC-63
Category：Discrete Semiconductor Products - Diodes - Rectifiers - Diode Arrays
Diode Configuration：1 Pair Common Cathode
Speed：Fast Recovery =< 500ns, > 200mA (Io)
Features：
• Ultrafast 35 Nanosecond Recovery Time
• Low Forward Voltage Drop
• Low Leakage
• ESD Rating:
♦Human Body Model = 3B (> 8 kV)
♦Machine Model = C (> 400 V)
• NRVUD, SRVUD and SNRVUD Prefixes for Automotive and OtherApplications Requiring Unique Site and Control ChangeRequirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHSComplian
Part Number：XC7K70T-2FBG484I
Manufacturer：AMD(XILINX)
Description ：Kintex®-7 Field Programmable Gate Array (FPGA) IC 285 4976640 65600 484-BBGA, FCBGA
Category：Integrated Circuit - Embedded - FPGAs (Field Programmable Gate Array)
Some highlights of the input/output functionality include:
• High-performance SelectIO technology with support for 1,866 Mb/s DDR3
• High-frequency decoupling capacitors within the package for enhanced signal integrity
• Digitally Controlled Impedance that can be 3-stated for lowest power, high-speed I/O operation
The number of I/O pins varies depending on device and package size. Each I/O is configurable and can comply with a large number of I/O standards. With the exception of the supply pins and a few dedicated configuration pins, all other package pins have the same I/O capabilities, constrained only by certain banking rules. The I/O in 7 series FPGAs are classed as high range (HR) or high performance (HP). The HR I/Os offer the widest range of voltage support, from 1.2V to 3.3V. The HP I/Os are optimized for highest performance operation, from 1.2V to 1.8V.
HR and HP I/O pins in 7 series FPGAs are organized in banks, with 50 pins per bank. Each bank has one common VCCO output supply, which also powers certain input buffers. Some single-ended input buffers require an internally generated or an externally applied reference voltage (VREF). There are two VREF pins per bank (except configuration bank 0). A single bank can have only one VREF voltage value.
Xilinx 7 series FPGAs use a variety of package types to suit the needs of the user, including small form factor wire-bond packages for lowest cost; conventional, high performance flip-chip packages; and bare-die flip-chip packages that balance smaller form factor with high performance. In the flip-chip packages, the silicon device is attached to the package substrate using a high-performance flip-chip process. Controlled ESR discrete decoupling capacitors are mounted on the package substrate to optimize signal integrity under simultaneous switching of outputs (SSO) conditions.
Part Number：LCMXO2-640HC-4TG100C
Manufacturer：Lattice Semiconductor Corporation
Description ：MachXO2 Field Programmable Gate Array (FPGA) IC 78 18432 640 100-LQFP
Category：Integrated Circuits - Embedded - FPGAs (Field Programmable Gate Array)
The MachXO2 family of ultra low power, instant-on, non-volatile PLDs has six devices with densities ranging from 256 to 6864 Look-Up Tables (LUTs). In addition to LUT-based, low-cost programmable logic these devices feature Embedded Block RAM (EBR), Distributed RAM, User Flash Memory (UFM), Phase Locked Loops (PLLs), pre-engineered source synchronous I/O support, advanced configuration support including dual-boot capability and hardened versions of commonly used functions such as SPI controller, I2C controller and timer/counter. These fea-tures allow these devices to be used in low cost, high volume consumer and system applications.
Part Number：XC3S500E-4PQG208C
Manufacturer：AMD(XILINX)
Description ：Spartan®-3E Field Programmable Gate Array (FPGA) IC 158 368640 10476 208-BFQFP
Category：Integrated Circuit - Embedded - FPGAs (Field Programmable Gate Array)
The Spartan-3E
FPGA architecture consists of five fundamental functional
elements:
• Input/Output Blocks (IOBs)
• Configurable Logic Block (CLB) and Slice Resources
• Block RAM
• Dedicated Multipliers
• Digital Clock Managers (DCMs)
The following sections provide detailed information on each of these functions. In addition, this section also describes the following functions:
• Clocking Infrastructure
• Interconnect
• Configuration
• Powering Spartan-3E FPGAs
The Spartan®-3E family of Field-Programmable Gate Arrays (FPGAs) is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The five-member family offers densities ranging from 100,000 to 1.6 million system gates, as shown in Table 1.
The Spartan-3E family builds on the success of the earlier Spartan-3 family by increasing the amount of logic per I/O, significantly reducing the cost per logic cell. New features improve system performance and reduce the cost of onfiguration. These Spartan-3E FPGA enhancements, combined with advanced 90 nm process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.
Because of their exceptionally low cost, Spartan-3E FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection, and digital television equipment.
The Spartan-3E family is a superior alternative to mask programmed ASICs. FPGAs avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.
Part Number：IPA65R150CFD
Manufacturer：Infineon Technologies
Description ：N-Channel 650 V 22.4A (Tc) 34.7W (Tc) Through Hole PG-TO220-3-111
Category：Discrete Semiconductor Products - Transistors - FETs, MOSFETs - Single FETs, MOSFETs
CooIMOS is a revolutionary technology for high voltage powerMOSFETS, designed according to the superjunction (S]) principle andpioneered by Infineon Technologies. 650V Coolmostm CFD2 seriesclass innovation. The resulting deviding SJ MOSFET supplier with highcombines the experience of the leades provide all benefits of a fastswitching SJ MOSFET while offering an extremely fast and robust bodydiode. This combination of extremely low switching, commutation andconduction losses together with highest robustness make especialresonant switching applications more reliable, more efficient, lighter and cooler
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