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Part Number：SN65HVD75DR
Category ：Integrated Circuits Interface - Drivers, Receivers, Transceivers
Description ：IC TRANSCEIVER HALF 1/1 8SOIC
Detailed Description：1/1 Transceiver Half RS422, RS485 8-SOIC
Applications：Factory Automation / Telecommunications Infrastructure / Motion Control.
Features：
• Small-size VSSOP Packages Save Board Space, or SOIC for Drop-in Compatibility
• Bus I/O Protection
– >±15 kV HBM Protection
– >±12 kV IEC 61000-4-2 Contact Discharge
– >±4 kV IEC 61000-4-4 Fast Transient Burst
• Extended Industrial Temperature Range –40°C to 125°C
• Large Receiver Hysteresis (80 mV) for Noise Rejection
• Low Unit-Loading Allows Over 200 Connected Nodes
• Low Power Consumption
– Low Standby Supply Current: < 2 µA
– ICC < 1 mA Quiescent During Operation
• 5-V Tolerant Logic Inputs Compatible With 3.3-V or 5-V Controllers
• Signaling Rate Options Optimized for: 250 kbps, 20 Mbps, 50 Mbps
• Glitch Free Power-Up and Power-Down Bus Inputs and Outputs
These devices have robust 3.3-V drivers and receivers in a small package for demanding industrial applications. The bus pins are robust to ESD events with high levels of protection to Human-Body Model and IEC Contact Discharge specifications.
Each of these devices combines a differential driver and a differential receiver which operate from a single 3.3-V power supply. The driver differential outputs and the receiver differential inputs are connected internally to form a bus port suitable for half-duplex (two-wire bus) communication. These devices feature a wide common-mode voltage range making the devices suitable for multi-point applications over long cable runs. These devices are characterized from –40°C to 125°C.
Part Number：SN74HC574DWR
Category ：Integrated Circuits Logic - Flip Flops
Description ：IC FF D-TYPE SNGL 8BIT 20SOIC
Detailed Description：Flip Flop 1 Element D-Type 8 Bit Positive Edge 20-SOIC (0.295", 7.50mm Width)
Output Type：Tri-State, Non-Inverted
These octal edge-triggered D-type flip-flops feature 3-state outputs designed specifically for bus driving.
They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
The eight flip-flops enter data on the low-to-high transition of the clock (CLK) input.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
Part Number：SN74LVC1G125DCKR
Category ：Integrated Circuits Logic - Buffers, Drivers, Receivers, Transceivers
Description ：IC BUF NON-INVERT 5.5V SC70-5
Detailed Description：Buffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output SC-70-5
Logic Type：Buffer, Non-Inverting
Applications：Cable Modem Termination System / High-Speed Data Acquisition and
Generation / Military: Radar and Sonar / Motor Control: High-Voltage / Power Line
Communication Modem / SSD: Internal or External / Video Broadcasting and Infrastructure: Scalable Platform / Video Broadcasting: IP-Based Multi-Format Transcoder / Video Communications System
This bus buffer gate is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G125 device is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is high.
The CMOS device has high output drive while maintaining low static power dissipation over a broad VCC operating range.
The SN74LVC1G125 device is available in a variety of packages including the ultra-small DPW package with a body size of 0.8 mm × 0.8 mm.
The SN74LVC1G125 device contains one buffer gate device with output enable control and performs the Boolean function Y = A. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The DPW package technology is a major breakthrough in IC packaging. Its tiny 0.64 mm square footprint saves significant board space over other package options while still retaining the traditional manufacturing friendly lead pitch of 0.5 mm.
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