So happy to get this good order from our Italy customer. After received the goods, the customer gave us a good evaluation: good product condition with timely delivery!
Order Information:
Part Number：SM6T6V8CA
Manufacturer：STMicroelectronics
Category ： Circuit Protection TVS - Diodes
Description ：TVS DIODE 5.8VWM 13.4VC SMB
Detailed Description：13.4V Clamp 298A (8/20µs) Ipp Tvs Diode Surface Mount SMB (DO-214AA)
Features：
• Peak pulse power: 600 W (10/1000 μs) and 4 kW (8/20 μs)
• Stand-off voltage range from 5 V to 188 V
• Unidirectional and bidirectional types
• Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C
• Operating Tj max: 150 °C
• High power capability at Tj max.: up to 515 W (10/1000 µs)
• Lead finishing: matte tin plating
The SM6T series are designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2 and MIL STD 883, method 3015, and electrical overstress according to IEC 61000-4-4 and 5. This device is more generally used against surges below 600 W (10/1000 μs).
The Planar technology makes it suitable for high-end equipment and SMPS wherelow leakage current and high junction temperature are required to provide reliability and stability over time.
The SM6T series are packaged in SMB.
Part Number：BLM21AG102BH1D
Manufacturer：Murata Electronics
Category ： Filters-Ferrite Beads and Chips
Corrosive gas：Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.
This product is designed to be mounted by soldering.
Other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
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