Chiplet is an advanced packaging technology. Multiple chip modules (die) with independent functions are integrated into one package through advanced packaging technology to form a high-performance, low-cost, and fast-to-market system-on-chip solution. This technology is similar to building blocks, allowing the design to flexibly combine chip modules with different functions and different manufacturing processes according to actual needs to meet diverse market needs. Semiconductor chips are the backbone of the technology-driven world, powering everything from smartphones to servers that support cloud computing. An obvious trend in modern devices is that the space available for specialized tasks is getting smaller and smaller, requiring these devices to effectively handle multiple workloads within limited physical constraints. The semiconductor industry is undergoing a major transformation, and as the boundaries of computing power, energy efficiency, and cost-effectiveness are constantly being pushed, traditional single-chip designs are facing more and more challenges. Enter chip-based architectures - an innovative solution that is expected to revolutionize semiconductor services and semiconductor solutions. Chiplet technology is centered on modular chips that can be combined to form an integrated system-on-chip (SoC). These chips are designed for chipset-based architectures, where multiple chipsets work together to create a unified circuit
What is Chiplet-based architecture
Chiplet price is a modular chip design approach in which multiple smaller silicon "chiplets" are interconnected to form a complete system. Unlike traditional chips where all components are integrated onto a single chip, it allows specialized functions to be developed and integrated independently, connected using high-bandwidth interconnects for efficient communication and performance optimization
This approach is gaining favor as the semiconductor industry strives to break through the physical and economic limitations of Moore's Law. By enabling smaller, reusable components, chiplet architecture provides flexibility, scalability and faster time to market for new semiconductor solutions
Several key factors driving the adoption of chiplet-based architectures
1. Complexity of traditional designs - The growing demand for more powerful processors makes monolithic designs increasingly complex and expensive. Manufacturing defects in large chips can result in significant losses. Chiplet architectures reduce risk by replacing defective components without discarding the entire system
2. Cost-effectiveness - The cost of advanced node manufacturing has skyrocketed. Chips built using mature process nodes reduce costs while leveraging cutting-edge semiconductor solutions for high-performance components. This hybrid approach is more economical and sustainable
3. Performance optimization - Chipsets enable heterogeneous integration, where different types of silicon (such as CPUs, GPUs, and accelerators) can be combined for optimal performance. This modularity provides tailored semiconductor services for specific applications from data centers to edge computing
Advantages of Chiplet Architecture
1. Flexibility and scalability - Chipsets make it easier to upgrade or modify designs. Manufacturers can replace or upgrade individual chipsets without redesigning the system, and this modularity promotes innovation and applicability
2. Improve yield - By splitting functions into smaller chips, manufacturers can reduce the possibility of defects in production. This can improve yield, reduce costs, and improve reliability
3. Customization to meet specific needs - Chiplet can tailor semiconductor solutions for the artificial intelligence, automotive, and telecommunications industries. This customization improves performance and meets the precise needs of market segments
4. Accelerate time to market - Reusability and parallel development of small chips shorten the design cycle, allowing companies to bring innovative products to market faster
Leading semiconductor companies such as AMD, Intel, and TSMC are leading the adoption of chip architecture. AMD's EPYC processor and Intel's Foveros technology demonstrate the potential of this approach
According to industry data reports, the advanced packaging market, including chiplets, is expected to grow at a compound annual growth rate of 8% between 2023 and 2028
According to forecasts, by 2025, 30% of advanced node processors will use chiplet-based architectures
Application areas of Chiplet
1. Data center and high-performance computing
Chiplet technology can integrate high-performance CPU and GPU modules to form a powerful technical capability to meet the needs of data centers for high-performance computing
In cloud computing, a large number of high-performance and high-reliability server chips are required to support various computing and storage tasks. Chiplet technology can achieve more efficient and reliable technology and storage services by splitting server chips into multiple small, independent computing and storage modules
2. Autonomous driving system
Chiplet technology can flexibly configure modules such as sensor processing, image recognition and path planning according to vehicle needs, improving the safety and reliability of autonomous driving systems
3. Mobile communication equipment
By integrating modules such as baseband processing, RF transceiver and power management, a highly integrated SoC solution is formed to improve the performance and endurance of mobile communication equipment
4. Artificial intelligence and machine learning
· Chiplet technology can integrate different types of technical units (such as CPU, GPU, NPU, etc.) to meet the needs of artificial intelligence and machine learning algorithms for high-performance computing
· Through modular design and advanced packaging technology, Chiplet technology provides higher flexibility and scalability for the design of AI chips
5. Internet of Things and edge computing
· Chiplet computing can provide low-power, high-performance chip solutions to meet the needs of IoT and edge computing devices for miniaturization, low power consumption, and high performance
· In IoT devices, Chiplet technology can integrate multiple functional modules to achieve device intelligence and interconnection
6. Communication field
· Chiplet technology is one of the early application areas in the communication industry. Chiplets are an effective solution for communication chips that have high requirements for high speed, high performance, and low power consumption.
· By splitting the communication chip into multiple small, independent functional modules, more flexible design and optimization can be achieved to meet the needs of different communication standards and formats
Challenges and future of chiplet technology
Although the chiplet architecture has many advantages, it also faces some challenges that cannot be ignored
· Chiplet technology requires the use of high-speed interconnection technology to connect different chiplets together. Currently commonly used interconnection technologies, such as high-speed SerDes, PCI Express, etc., have certain limitations in terms of bandwidth and cost of technology
· Chiplet technology requires the use of advanced packaging technologies (such as 3D integration, 2.5D integration, etc.) to package different chiplets together. These packaging technologies are not only highly complex, but also relatively expensive
· Chiplet technology requires a complete ecosystem to support it, including design tools, manufacturing processes, testing tools, etc. At present, the ecosystem of chiplet technology needs to be improved, and more companies and institutions need to join in the construction of the chiplet ecosystem
· Chiplet technology requires unified standards to standardize the interface and interconnection methods of chiplets. At present, there are many chiplet interconnection standards in the industry, but a unified standard system has not yet been formed
