Chip interconnection technology refers to the technology of establishing efficient, stable and reliable connections between different chips or different functional modules inside the chip. With the improvement of chip integration and performance enhancement, chip interconnection technology has become one of the key factors restricting system performance
Technology classification and characteristics
There are two main categories of chip interconnection technology
1. On-chip interconnection:
It means that different functional modules (such as processors, memory, input and output interfaces, etc.) are efficiently connected together through specific connection means inside the chip to achieve the connection between different functional modules inside the chip to complete the rapid transmission of information and collaborative work. It is a key link in chip design and manufacturing, and has an important impact on the function and power consumption of the chip
① Technical method:
On-chip interconnection mainly uses metal wires, through-holes and other technologies to realize the connection between different functional modules inside the chip. Metal wires are used to arrange circuit patterns on the surface of the chip, while through-holes are used to achieve connections between different metal layers. These lines are usually very small and can be arranged into complex circuit patterns on the surface of the chip to transmit electronic signals and electricity.
With the advancement of technology, new technologies such as through silicon vias (TSV) have also emerged, which can realize internal connections in the vertical direction of the chip, further improving the integration and performance.
②Main features:
High density: As the integration of chips increases, the density of on-chip interconnections is also getting higher and higher, and a large number of connection lines need to be arranged within a limited chip area.
Low latency: In order to ensure fast communication between various functional modules inside the chip, on-chip interconnection technology needs to achieve low-latency signal transmission.
Low power consumption: While ensuring performance, it is also necessary to consider reducing power consumption to extend the service life of the chip.
2. Off-chip interconnection:
Through bumps, flip-chip soldering, wire bonding and other methods, connections between different chips are realized to complete the rapid transmission of information and collaborative work. It is a key link in multi-chip systems such as SoC and SiP, and has an important impact on the overall performance and reliability of the system.
①Technical method
Wire bonding:
It is the earliest developed interconnection method, using materials with good electrical properties (such as gold, silver, and copper) as wires to connect chips and substrates. This method is cost-effective and reliable, but due to the long electrical path, it is not suitable for devices that require high-speed operation.
Flip chip bonding:
It overcomes the shortcomings of wire bonding, shortens the length of the electrical path, and is suitable for high-speed operation. Flip chip bonding can also form bumps on the entire side of the chip, providing more inputs and outputs (I/O), thereby providing higher data processing speeds.
Through silicon via (TSV) bonding:
By drilling holes on the chip and filling them with conductive materials such as metal to achieve vertical connection, TSV technology allows many chips to be stacked, further improving integration and performance.
Mixed bonding of small chips:
Such as chiplet technology, which separates each chip according to function and then reconnects them through packaging. This technology can reduce manufacturing costs and increase the flexibility of chip design.
In general, on-chip interconnection and off-chip interconnection technologies are responsible for the connection inside and between chips, respectively, and have an important impact on the performance, power consumption, reliability, etc. of chips and systems. With the continuous advancement of technology and the continuous growth of application needs, on-chip interconnection and off-chip interconnection technologies are also constantly developing and innovating.
